Multiprocessing White Papers

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SPARC T4 Servers – Optimized for End-to-End Data Center Computing
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn how Oracle’s SPARC T4 servers deliver new levels of end-to-end data center performance never before seen in the T-Series line of servers.
Posted: 11 Apr 2012 | Published: 11 Apr 2012

Oracle Corporation

Red Hat Enterprise Linux 6 Scalability
sponsored by DLT Solutions.
WHITE PAPER: Scalability is one of the areas of focus in Red Hat Enterprise Linux 6. The importance of scalability is driven by the convergence of several factors, which have combined to create a strong customer demand for a high performance, production ready Linux infrastructure. Read this paper to learn more about scalability and Red Hat Enterprise Linux 6.
Posted: 10 Mar 2011 | Published: 10 Mar 2011

DLT Solutions.

Advance Beyond the Barriers of Your Legacy Computing Infrastructure
sponsored by Sybase
WHITE PAPER: For customers running Sybase ASE 12.5 on Solaris 8, the long-planned end of support for that platform means that they must move their workloads to a new environment or face special support contracts. Moving to HP infrastructure brings immediate payback through lower support costs and reduction in power and cooling requirements.
Posted: 30 Sep 2010 | Published: 30 Sep 2010

Sybase

Enabling Manageability with Intel Active Management Technology
sponsored by Intel Corporation
WHITE PAPER: Learn how Intel IT is implementing Intel Active Management Technology across the enterprise.
Posted: 21 Nov 2008 | Published: 21 Nov 2008

Intel Corporation

Intel® Xeon® Processor 5500 Series: An Intelligent Approach to IT Challenges
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel

Maximizing IT Value by Using High-End Server Processors
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Intel IT has standardized on Intel® Xeon® processors with a core frequency of 3 GHz for two-socket servers for design computing and enterprise server virtualization.
Posted: 24 Oct 2008 | Published: 23 Oct 2008

Dell, Inc. and Intel®

The All New 2010 Intel Core vPro Processor Family and Windows 7: Your Best Choice for Business PCs
sponsored by Intel
WHITE PAPER: The all new Intel® Core™ vPro™ processor family complements the new Windows® 7 operating system by building effective trusted computing and management mechanisms into the hardware. Read this paper to learn more.
Posted: 04 Oct 2010 | Published: 25 Jan 2010

Intel

Dell: Expanding Its Position as an HPC Market Leader
sponsored by Dell, Inc. and Intel®
WHITE PAPER: With several offerings available, choosing the ideal high performance computing (HPC) offering for your business can be a daunting task. This resource examines one well-reputed HPC vendor and explains how it differentiates itself in the competitive marketplace.
Posted: 02 Apr 2012 | Published: 01 Apr 2011

Dell, Inc. and Intel®

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

AMD and HP are Proven in Business: A Decade of Industry-Leading Technology Innovation
sponsored by AMD, Hewlett-Packard and Microsoft
WHITE PAPER: AMD and HP have collaborated to deliver an outstanding technology portfolio — from the desktop to the datacenter — that continues to grow more robust every year. Using AMD Opteron processors, HP delivers server designs that offer high performance, while at the same time helping to reduce power and cooling requirements. Read this paper for more.
Posted: 09 Aug 2010 | Published: 04 Aug 2010

All resources sponsored by AMD, Hewlett-Packard and Microsoft