Electrical Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Solihull Council Marks a Decade with Red Hat Open Source Technology , Saving over £1 Million
sponsored by Red Hat - HPE
WHITE PAPER: In this informative paper, learn why a government industry has relied on the same Linux solution for the past ten years, using an open source model to simplify software and hardware implementations, reduce costs, and more.
Posted: 10 Apr 2013 | Published: 10 Apr 2013

Red Hat - HPE

Dell: Expanding Its Position as an HPC Market Leader
sponsored by Dell, Inc. and Intel®
WHITE PAPER: With several offerings available, choosing the ideal high performance computing (HPC) offering for your business can be a daunting task. This resource examines one well-reputed HPC vendor and explains how it differentiates itself in the competitive marketplace.
Posted: 02 Apr 2012 | Published: 01 Apr 2011

Dell, Inc. and Intel®

A reference architecture for a leading solution
sponsored by DellEMC and Intel®
WHITE PAPER: This white paper explores the reference architecture for a leading server solution. Learn how this architecture is designed to influence the benefits of virtualizing the underlying infrastructure and address the common problems associated with hardware sprawl.
Posted: 21 Oct 2014 | Published: 30 Sep 2014

DellEMC and Intel®

Running SAP NetWeaver on the Oracle Exalogic Elastic Cloud: An Architectural Overview
sponsored by Oracle Corporation
WHITE PAPER: This white paper underscores the importance of a cohesive SAP infrastructure. Explore a recommended architecture and the process involved in implementing it.
Posted: 02 Aug 2012 | Published: 01 Sep 2011

Oracle Corporation

Cisco UCS C-Series Rack Servers for Microsoft Exchange 2010
sponsored by Insight
WHITE PAPER: Explore this solution brief to learn about an innovative rack server series specifically designed to help organizations deploy and effectively run Microsoft Exchange Server environments. Learn more about the advanced features and benefits of this hardware.
Posted: 22 Apr 2013 | Published: 22 Apr 2013

Insight