64 bit Architecture White Papers

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SPARC T4 Servers – Optimized for End-to-End Data Center Computing
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn how Oracle’s SPARC T4 servers deliver new levels of end-to-end data center performance never before seen in the T-Series line of servers.
Posted: 11 Apr 2012 | Published: 11 Apr 2012

Oracle Corporation

Virtualized SAP Solution Using Cisco Unified Computing System and EMC CLARiiON Storage
sponsored by Cisco Systems, Inc.
WHITE PAPER: This study details the performance scalability of the Cisco unified computing system (UCS) platform coupled with Intel Xeon 5600 series processors and EMC CLARiiON storage, and demonstrates why it's a great fit for virtualized SAP solutions.
Posted: 23 Nov 2011 | Published: 31 Dec 2010

Cisco Systems, Inc.

Supporting Medical Imaging in the Cloud
sponsored by Intel
WHITE PAPER: This resource demonstrates how Carestream Health created a powerful, scalable data center platform able to accommodate more users without sacrificing service quality. Learn how they improved processing power, allowing them to meet the challenges of serving more users while handling more data-intensive workloads.
Posted: 29 Oct 2012 | Published: 29 Oct 2012

Intel

Advance Beyond the Barriers of Your Legacy Computing Infrastructure
sponsored by Sybase
WHITE PAPER: For customers running Sybase ASE 12.5 on Solaris 8, the long-planned end of support for that platform means that they must move their workloads to a new environment or face special support contracts. Moving to HP infrastructure brings immediate payback through lower support costs and reduction in power and cooling requirements.
Posted: 30 Sep 2010 | Published: 30 Sep 2010

Sybase

Your Trusted Partner for Oracle Customers Migrating Intel Itanium Workloads
sponsored by Cisco Systems, Inc.
WHITE PAPER: This paper examines the choices available to organizations that need to migrate away from Intel Itanium processor-based servers.
Posted: 11 Oct 2011 | Published: 11 Oct 2011

Cisco Systems, Inc.

Intel® Xeon® Processor 5500 Series: An Intelligent Approach to IT Challenges
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel

IT Security: Built-In Protection with Intel vPro Technology
sponsored by Intel
WHITE PAPER: New security threats are constantly emerging, and it is your responsibility to properly protect your business. This white paper discusses four key aspects of IT security and explains how you can effectively address them by implementing processors with built-in security features.
Posted: 12 Jun 2012 | Published: 01 May 2012

Intel

Enabling Manageability with Intel Active Management Technology
sponsored by Intel Corporation
WHITE PAPER: Learn how Intel IT is implementing Intel Active Management Technology across the enterprise.
Posted: 21 Nov 2008 | Published: 21 Nov 2008

Intel Corporation

Dual-Core Intel® Itanium® 2 Processor 9000 Series
sponsored by Intel and Microsoft
WHITE PAPER: Learn how the Dual-Core Intel® Itanium® 2 processor 9000 from the Dual-core Intel® Itanium® 2 Processor 9000 Series can deliver new levels of performance, flexibility and value for your data-intensive business and te...
Posted: 10 Jul 2007 | Published: 01 Jan 2006

Intel and Microsoft

AMD and HP are Proven in Business: A Decade of Industry-Leading Technology Innovation
sponsored by AMD, Hewlett-Packard and Microsoft
WHITE PAPER: AMD and HP have collaborated to deliver an outstanding technology portfolio — from the desktop to the datacenter — that continues to grow more robust every year. Using AMD Opteron processors, HP delivers server designs that offer high performance, while at the same time helping to reduce power and cooling requirements. Read this paper for more.
Posted: 09 Aug 2010 | Published: 04 Aug 2010

All resources sponsored by AMD, Hewlett-Packard and Microsoft